MCN-UV80 Mechanic No Clean BGA Tin Solder Flux Paste



Mechanic No Clean BGA Tin Solder Flux Paste is high bond strength and PH value neutral. MCN-UV80 welding flux paste’s insulation is strong with welding surface smooth. This rosin soldering flux paste is the best for IC and PCB for no corrosive.


  • 100% brand new and high quality.
  • High synthetic BGA Solder Paste Tin Rosin-Based Flux Paste Cream.
  • PH value neutral, insulation is strong, welding surface smooth.
  • Professional Soldering Tin Flux for PC Cards Electronic Chip-level Welding.
  • Its boiling point only slightly higher than the melting point of the solder.
  • Unique recipes, perfect performance, easy to weld, solder bright and full, no weld, false welding and so on.
  • Good soldering and welding tools.
  • IC and PCB for no corrosive
  • Super compacity: Applicable to PCB, BGA, SMD, PGA repair, Soldering, etc.
  • Rosin-based Solder Paste.


  1. Material: Plastic+ Rosin-based solder paste
  2. Size: 80g
  3. Type: Rosin-based BGA solder flux cream
  4. Viscosity: 0.2Pas
  5. Granularity: 0.22um
  6. Application: for Phone BGA Board Soldering Fixing
  7. Function: PC Cards Electronic Chip-level Welding

​Package Includes:

  • 1 x Tin Soldering Flux Paste MCN-UV80

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