Mechanic No Clean BGA Tin Solder Flux Paste is high bond strength and PH value neutral. MCN-UV80 welding flux paste’s insulation is strong with welding surface smooth. This rosin soldering flux paste is the best for IC and PCB for no corrosive.
- 100% brand new and high quality.
- High synthetic BGA Solder Paste Tin Rosin-Based Flux Paste Cream.
- PH value neutral, insulation is strong, welding surface smooth.
- Professional Soldering Tin Flux for PC Cards Electronic Chip-level Welding.
- Its boiling point only slightly higher than the melting point of the solder.
- Unique recipes, perfect performance, easy to weld, solder bright and full, no weld, false welding and so on.
- Good soldering and welding tools.
- IC and PCB for no corrosive
- Super compacity: Applicable to PCB, BGA, SMD, PGA repair, Soldering, etc.
- Rosin-based Solder Paste.
- Material: Plastic+ Rosin-based solder paste
- Size: 80g
- Type: Rosin-based BGA solder flux cream
- Viscosity: 0.2Pas
- Granularity: 0.22um
- Application: for Phone BGA Board Soldering Fixing
- Function: PC Cards Electronic Chip-level Welding
- 1 x Tin Soldering Flux Paste MCN-UV80
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